Position Summary

As a High Voltage Packaging Engineer, you’ll take ownership of advanced package design and process development — from concept through high-volume manufacturing. You’ll work closely with global cross-functional teams, gaining visibility across multiple product lines and contributing to the next generation of power electronics packaging technologies.

Key Responsibilities:

• Define, design, and scale high-voltage (200–3300V) packages and power modules
• Develop competitive package and module roadmaps aligned with market needs
• Validate designs using CFD, thermomechanical, and electrical modeling tools
• Create new process flows for prototype and high-volume manufacturing
• Partner with suppliers to optimize materials and equipment for HV applications

Qualifications:

• Master’s degree in mechanical, Materials, or Electrical Engineering (or related field)
• 10+ years of experience in high-voltage and high-power semiconductor packaging
• Proven expertise across GaN, SiC, IGBT, and Super Junction MOSFET technologies
• Hands-on experience with molded packages (TOLT, TOLG, Q-DPAK, DIP, SIP, case modules)
• Strong knowledge of stress, thermal, and electrical modeling tools

Preferred Skills:

• Experience scaling HV modules from prototype to high-volume manufacturing
• Familiarity with clip attach, flip chip, and wafer bumping processes
• Deep knowledge of HV materials (mold compounds, die attach, DBC substrates)
• Strong communication and cross-functional leadership skills

Equal Opportunity Employer

This company is committed to fostering an inclusive and diverse workplace, prohibiting discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender identity, sexual orientation, or any other legally protected status.