Position Summary

A global semiconductor innovator is seeking a High Voltage Packaging Engineering Manager to drive new package design, process development, and high-volume manufacturing of advanced power modules. The successful candidate will define packaging roadmaps, lead cross-functional teams, and deliver innovative solutions across GaN, SiC, and IGBT technologies.

Key Responsibilities:

• Design, develop, and scale high-voltage (200–3300V) packages and high-power modules.
• Define packaging and module roadmaps based on market and system requirements.
• Develop new processes and materials to support prototype and volume manufacturing.
• Conduct reliability testing, failure analysis, and implement corrective measures.
• Collaborate globally with suppliers and engineering teams to accelerate time-to-market.
• Integrate thermal, mechanical, and electrical modeling into design and validation efforts.

Qualifications:

• Master’s degree in Mechanical, Materials, or Electrical Engineering (or related field).
• 10+ years of experience in high-voltage and high-power semiconductor packaging.
• Proven expertise in GaN, SiC, and IGBT module design, process integration, and reliability testing.
• Strong knowledge of thermal, stress, and electrical modeling tools.
• Experience leading technical teams and managing cross-functional development projects.

Equal Opportunity Employer

This company is committed to fostering an inclusive and diverse workplace, prohibiting discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender identity, sexual orientation, or any other legally protected status.