Position Summary

A leading semiconductor manufacturer is seeking an experienced Process Integration Engineer to join their team in Hillsboro, OR. This position offers the opportunity to work in a dynamic team environment within a cutting-edge semiconductor fabrication facility. The focus of this role is to collaborate with device, process module, and product engineering teams to develop silicon power device process technology and improve existing technology yield. Primary responsibilities include process flow implementation, electrical characterization (failure analysis), and wafer-level testing yield monitoring.

Key Responsibilities

New Product Introduction (NPI)

• Collaborate with product engineering teams to perform New Product Introduction (NPI) on existing platforms.
• Analyze DOE (Design of Experiments) and pre-production lot data, ensuring documentation aligns with NPI procedures.
• Work closely with design teams to troubleshoot device-related issues and provide technical documentation to optimize process technology efficiency.

Yield Monitoring & Improvement

• Conduct daily monitoring of wafer-level testing yield for existing technologies.
• Identify low-yield root causes through failure analysis, inline data assessment, and lot history tracking.
• Work with process module teams to optimize inline controls, adjust process targets, and refine recipes for continuous yield enhancement.

Required Experience & Education

• Master’s or PhD in Electrical Engineering or a related engineering field.
• Strong working knowledge of semiconductor process technology and wafer fabrication.

Preferred Qualifications & Skills

• Understanding of semiconductor device physics and experience in device processing and integration.
• Experience with test structure definition, design rule generation, DOE, failure analysis, process control document (PCD) creation, and device characterization.
• Knowledge of high-voltage discrete power devices (MOSFETs, IGBTs, TVS) is preferred.

About the Company

This company is a global leader in semiconductor technology, specializing in power management solutions. Their expertise integrates discrete and IC semiconductor process technology, product design, and advanced packaging to develop high-performance solutions for applications such as consumer electronics, industrial motor controls, power supplies, and telecommunications equipment.

The company operates an in-house wafer fabrication facility in Hillsboro, OR, ensuring end-to-end control over semiconductor manufacturing and production processes.

Equal Opportunity Employer

This company is committed to fostering an inclusive and diverse workplace, prohibiting discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender identity, sexual orientation, or any other legally protected status.